Thermal Management Consulting
One team carries thermal design, simulation, prototype validation, and mass-production support end to end. Join at concept and more options stay open; join weeks before launch and we find the highest-leverage change left in your remaining design freedom.
Once the architecture is locked, swapping thermal parts rarely closes the gap. We rebuild the heat path inside the freedom you have left — Z-height, thermal envelope, materials — and prove the highest-leverage change in simulation first.
If tool licensing and a full-time analyst are hard to justify at your size, borrow the capability only when a programme needs it. The native models and reports stay with you.
We turn TIM dispense volume and bond line thickness, assembly clamping pressure, and vapor chamber vacuum and sealing conditions into defined CTQs, with process FMEA and control plan to match.
We compare the candidates on thermal resistance, thickness, unit cost, and production yield under the same conditions. We have no stake in which one wins.
Sourcing each stage separately leaves gaps between simulation assumptions and real design, and between prototype and production part. We keep all four stages on one dataset. Training and technical due diligence are offered separately.
Define heat paths at concept stage and lock a thermal architecture that fits your space, weight, and cost constraints.
Predict temperature distribution with 3D CFD and conduction analysis, and quantify what each design change actually buys.
Build the design and measure it. Low-volume, short-lead-time fabrication through our partner network.
Make sure prototype performance survives the transfer to volume manufacturing.
Heat density and constraints differ by form factor. We work to the design conventions of each segment.
Topics we keep running into on real programs, written up each quarter.
A specification with "43°C" on one line is usually wrong. Why the allowable temperature depends on contact duration and surface material, and how to set a defensible design target.
A 6 W/m·K product can perform worse than a 3 W/m·K one. Here's why resistance — not conductivity — is the number that matters, and how to compare candidates properly.
"How many watts can air handle" has no answer. Convert heat flux and allowable temperature rise into a required heat transfer coefficient, and check what to settle before switching.
No CAD data or 3D model required. Share heat load (W), form factor, and target temperature (°C), and we will come back within two business days with an approach and an estimated lead time.